Interface microstructure and diffusion mechanism in the diffusion bonding of copper and aluminum

International Journal for the Joining of Materials

Volumn 18, Issue 3-4, 2006, Pages 94-98

  Li, Yajiang ^a   Wang, Juan ^a   Xia, Chunzhi ^a  

^a SHANDONG UNIVERSITY   (China)

Author keywords

Aluminum; Copper; Diffusion mechanism; Microstructure; Vacuum diffusion bonding

Indexed keywords

ALUMINUM; BONDING; COPPER; INTERFACES (MATERIALS); MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY;

DIFFUSION JOINTS; DIFFUSION MECHANISM; VACUUM DIFFUSION BONDING;

JOINTS (STRUCTURAL COMPONENTS);

EID: 33845976652     PISSN: 09056866     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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