Numeric simulation of thickness of intermetallic compounds in interface zone of diffusion bonding for Cu and Al

Transactions of Nonferrous Metals Society of China (English Edition)

Volumn 11, Issue 6, 2001, Pages 908-911

  Li, Ya Jiang ^a   Wu, Hui Qiang ^a   Chen, Mao Ai ^a   Feng, Tao ^a  

^a SHANDONG UNIVERSITY   (China)

Author keywords

Intermetallic compounds; Numeric simulation; Vacuum diffusion bonding

Indexed keywords

BONDING; INTERDIFFUSION (SOLIDS); INTERMETALLICS; MATHEMATICAL MODELS; THICKNESS MEASUREMENT;

ELECTRONIC PROBE MICROSCOPY; INTERFACE ZONE; VACUUM DIFFUSION BONDING; VACUUM DIFFUSION WELDING;

ALUMINUM COPPER ALLOYS;

EID: 0035735606     PISSN: 10036326     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

1. Partially melted zone in aluminum welds-liquation mechanism and directional solidification
2. Microstructural and mechanical characterization of actively brazed alumina tensile specimens
3. Welding characteristics of aluminum alloys for railway vehicles
4. Application of diffusion welding in the U.S.A.
5. 3P/6061Al
6. Interfacial reaction of TB2/Cu/TB2 diffusion welding
7. Forming mechanism of interface intermetallic compounds for diffusion bonding
8. Effect of melt superheating on microstructure and mechanical properties of A357 alloy
9. Interfacial reactions of titanium and aluminum during diffusion welding
10. Intermetallic compound growth in Tin and Tin-lead plating over nickel and its effect on solderability
11. The application of vacuum diffusion welding making diffusion couple in research on atomic diffusion
12. Numeric simulation for interface intermetallic compounds of phase transformation diffusion bonding