Experimental validation of crosstalk simulations for on-chip interconnects at high frequencies using s-parameters

Electrical Performance of Electronic Packaging

Volumn , Issue , 2003, Pages 329-332

  Kobrinsky, Mauro J ^a   Chakravart, Sourav ^a   Jiao, Dan ^a   Harmes, Michael ^a   List, Scott ^a   Mazumdei, Mohiuddin ^a  

^a INTEL CORPORATION   (United States)

Author keywords

S parameters; Signal integrity; Validation

Indexed keywords

AIR NAVIGATION; COMPUTATION THEORY; CROSSTALK; DESIGN; ECONOMIC AND SOCIAL EFFECTS; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT INTERCONNECTS;

CROSSTALK SIMULATIONS; EXPERIMENTAL VALIDATIONS; FULL-WAVE SIMULATIONS; FUNCTION OF FREQUENCY; MAGNETO QUASI STATICS; ON-CHIP INTERCONNECTS; SIGNAL INTEGRITY; VALIDATION;

SCATTERING PARAMETERS;

EID: 33845910484     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2003.1250061     Document Type: Conference Paper

References (2)

1. D. M. Pozar, Microwave Engineering, 2nd ed., John Wiley & Sons, 1998.
2. D. Jiao, M. Mazumder, S. Chaknavarty, C. Dai, M. Kobrinsky, M. Harmes, and S. List, "A novel technique for full-wave modeling of targe-scale three-dimensional high-speed on/off-chip interconnect structures", SJSPAD 2003.