Scalable driver I/O macromodels for statistical analysis

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2005, Issue , 2005, Pages 239-242

  Mutnury, Bhyrav ^a   Swaminathan, Madhavan ^a   Cases, Moises ^b   Pham, Nam ^b   De Araujo, Daniel N ^b   Matoglu, Erdem ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b xSeries eServer Development   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DRIVER-RECEIVER CIRCUITS; I/O MACROMODELS; LAGRANGE'S INTERPOLATION TECHNIQUE;

COMPUTER SIMULATION; ELECTRIC POTENTIAL; INTERPOLATION; MATHEMATICAL MODELS; SEMICONDUCTOR DEVICES;

INPUT OUTPUT PROGRAMS;

EID: 33845870905     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2005.1563747     Document Type: Conference Paper

References (7)

1. EBIS Open Forum on http://www.eia.org/eig/ibis/ibis.htm, Sep. 1997.
2. A. Varma, A. Glaser, S. Lipa, M. Steer, and P. Franzon, "The development of a macro-modeling tool to develop IBIS models," Electrical Performance of Electronic Packaging, pp. 277-280, 27-29 Oct. 2003.
3. A. Varma, A. Glaser, S. Lipa, M. Steer, and P. Franzon, "Simultaneous switching noise in IBIS models," International Symposium on Electromagnetic Compatibility, EMC 2004, vol. 3, pp. 1000-1004, Aug. 2004.
4. B. Mutnury, M. Swaminathan and J. Libous, "Macro-Modeling of Non-Linear Digital I/O Drivers," accepted for IEEE Transactions on Advanced Packaging, 2005.
5. I.S. Stievano, I.A. Maio, F.G. Canavero, "Temperature-dependent macromodels of digital devices," in Proc. IEEE Int. Symp. on Electromagnetic Compatibility (EMC), Zurich, Switzerland, pp. 321-326, Feb. 2003.
6. B. Mutnury, M. Swaminathan, M. Cases, N. Pham, D. N. de Araujo and E. Matoglu, "Macro-Modeling of Non-Linear Pre-emphasis Differential Driver Circuits," IEEE International Microwave Symposium (IMS) 2005, Long Beach, CA, June 2005.
7. B. Mutnury, M. Swaminathan, M. Cases, N. Pham, D. N. de Araujo and E. Matoglu, "Macro-Modeling of Transistor Level Receiver Circuits," 13th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2004), pp. 243-246, Portland, Or, Oct. 2004.