Fabrication and microstructure of W/Cu functionally graded material

Journal of University of Science and Technology Beijing: Mineral Metallurgy Materials (Eng Ed)

Volumn 8, Issue 3, 2001, Pages 198-202

  Ling, Y ^a   Li, J ^a   Zhou, Z ^a   Ge, C ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

Author keywords

Composite; Copper; Functionally graded material; Sintering; Tungsten

Indexed keywords

COPPER; DENSIFICATION; MECHANICAL PROPERTIES; METALLIC MATRIX COMPOSITES; METALLOGRAPHIC MICROSTRUCTURE; PLASTICITY; SINTERING; STRENGTH OF MATERIALS; THERMAL CONDUCTIVITY; THERMAL EFFECTS; THERMAL EXPANSION; THERMAL STRESS;

HEAT CORROSION; MELTING POINT; SERVICE STRENGTH; THERMAL EXPANSION COEFFICIENT; THERMAL SHOCK RESISTANCE; TUNGSTEN COPPER FUNCTIONALLY GRADED MATERIAL;

TUNGSTEN ALLOYS;

EID: 0035441006     PISSN: 10058850     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)