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Volumn 15, Issue 6, 2006, Pages 447-455

Effects of bismaleimide resin on dielectric and dynamic mechanical properties of epoxy-based laminates

Author keywords

Bismaieimide; DEA; DMA; Epoxy amine; Laminates

Indexed keywords

AMINES; CURING; DYNAMIC MECHANICAL ANALYSIS; EPOXY RESINS; IONIC CONDUCTION; PERMITTIVITY; REINFORCEMENT;

EID: 33845677762     PISSN: 10261265     EISSN: 10261265     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (2)

References (18)
  • 1
    • 4444223810 scopus 로고    scopus 로고
    • Synthesis and characterization of polyurethane-toughened Epoxy-bismaleimide matrices
    • Mahesh K. P.O., Alagar M., Kumar R. S., Synthesis and characterization of polyurethane-toughened Epoxy-bismaleimide matrices, High. Perform. Polym., 16, 391-404, 2004.
    • (2004) High. Perform. Polym. , vol.16 , pp. 391-404
    • Mahesh, K.P.O.1    Alagar, M.2    Kumar, R.S.3
  • 2
    • 0344016938 scopus 로고    scopus 로고
    • Recent advances in bismaleimides and epoxy-imide / bismaleimide formulations and composites
    • Chandra R., Rajabi L., Recent advances in bismaleimides and epoxy-imide / bismaleimide formulations and composites, J.M.S. Rev. Macromol. Chem. Phys., C37, 61-96, 1997.
    • (1997) J.M.S. Rev. Macromol. Chem. Phys. , vol.C37 , pp. 61-96
    • Chandra, R.1    Rajabi, L.2
  • 3
    • 33845601273 scopus 로고
    • Heat resistive resin compositions comprising an epoxy, organic acid anhydride, and maleimide
    • US Patent 3,730,948
    • Akiyama K., Makino K., Heat resistive resin compositions comprising an epoxy, organic acid anhydride, and maleimide, US Patent 3,730,948, 1973.
    • (1973)
    • Akiyama, K.1    Makino, K.2
  • 4
    • 33845666917 scopus 로고
    • Arylimide-epoxy resin composites
    • US Patent 3,920,768
    • Kwiatkowski G. T., Arylimide-epoxy resin composites, US Patent 3,920,768, 1975.
    • (1975)
    • Kwiatkowski, G.T.1
  • 5
    • 33845679878 scopus 로고
    • Aromatic bismaleimide and prepreg resin therefrom
    • US Patent 4,654,407
    • Domeier L. A., Aromatic bismaleimide and prepreg resin therefrom, US Patent 4,654,407, 1987.
    • (1987)
    • Domeier, L.A.1
  • 6
    • 0025476262 scopus 로고
    • Relaxations of thermosets. IV: A dielectric study of cross-linking of diglycidyl ether of bisphenol-A by two curing agents
    • Mangion M. B. M., Johari G. P., Relaxations of thermosets. IV: A dielectric study of cross-linking of diglycidyl ether of bisphenol-A by two curing agents, J. Polym. Sci., Pol. Phys., 28, 1621-1631, 1990.
    • (1990) J. Polym. Sci., Pol. Phys. , vol.28 , pp. 1621-1631
    • Mangion, M.B.M.1    Johari, G.P.2
  • 7
    • 0026203593 scopus 로고
    • Relaxations in thermosets. IX: Ionic conductivity and gelation of DGEBA-based thermosets cured with pure and mixed amines
    • Mangion M. B. M., Johari G. P., Relaxations in thermosets. IX: Ionic conductivity and gelation of DGEBA-based thermosets cured with pure and mixed amines, J. Polym. Sci., Pol. Phys., 29, 1117-1125, 1991.
    • (1991) J. Polym. Sci., Pol. Phys. , vol.29 , pp. 1117-1125
    • Mangion, M.B.M.1    Johari, G.P.2
  • 9
    • 0024936202 scopus 로고
    • Highly cross-linked polymers
    • Kaiser T., Highly cross-linked polymers, Prog. Polym. Sci., 14, 373-450, 1989.
    • (1989) Prog. Polym. Sci. , vol.14 , pp. 373-450
    • Kaiser, T.1
  • 10
    • 0004492038 scopus 로고
    • The interpretation of electrical resistivity measurements during epoxy resin cure
    • Fava R. A., Horsfield A. E., The interpretation of electrical resistivity measurements during epoxy resin cure, Br. J. Appl. Phys., 1, 117, 1968.
    • (1968) Br. J. Appl. Phys. , vol.1 , pp. 117
    • Fava, R.A.1    Horsfield, A.E.2
  • 12
    • 0030270802 scopus 로고    scopus 로고
    • The effect of bismaleimide resin on curing kinetics of epoxy-amine thermosets
    • Chandra R., Rajabi L., Soni R. K., The effect of bismaleimide resin on curing kinetics of epoxy-amine thermosets, J. Appl. Polym. Sci., 62, 661-671, 1996.
    • (1996) J. Appl. Polym. Sci. , vol.62 , pp. 661-671
    • Chandra, R.1    Rajabi, L.2    Soni, R.K.3
  • 14
    • 0022739149 scopus 로고
    • The physical properties of bisphenol-a-based epoxy resins during and after curing
    • Choy I., Plazek D. J., The physical properties of bisphenol-A-based epoxy resins during and after curing, J. Polym. Sci., Pol. Phys., 24, 1303-1320, 1986.
    • (1986) J. Polym. Sci., Pol. Phys. , vol.24 , pp. 1303-1320
    • Choy, I.1    Plazek, D.J.2
  • 15
    • 0025507111 scopus 로고
    • Kinetic study of the cross-linking reaction of flexible bismaleimides
    • Acevedo M., de Abajo J., de la Campa J.G., Kinetic study of the cross-linking reaction of flexible bismaleimides, Polymer, 31, 1955-1959, 1990.
    • (1990) Polymer , vol.31 , pp. 1955-1959
    • Acevedo, M.1    De Abajo, J.2    De La Campa, J.G.3
  • 16
    • 0021389088 scopus 로고
    • Reactions of diaminoalkanes with bismaleimides: Synthesis of some unusual polyimides
    • White J.E., Scala M.D., Snider D.A., Reactions of diaminoalkanes with bismaleimides: Synthesis of some unusual polyimides, J. Appl. Polym. Sci., 29, 891-899, 1984.
    • (1984) J. Appl. Polym. Sci. , vol.29 , pp. 891-899
    • White, J.E.1    Scala, M.D.2    Snider, D.A.3
  • 17
    • 0027112915 scopus 로고
    • Analysis of the curing behaviour of bismaleimide resins
    • Tungare A.V., Martin G.C., Analysis of the curing behaviour of bismaleimide resins, J. Appl. Polym. Sci., 46, 1125-1135, 1992.
    • (1992) J. Appl. Polym. Sci. , vol.46 , pp. 1125-1135
    • Tungare, A.V.1    Martin, G.C.2
  • 18
    • 0021405799 scopus 로고
    • An additive for increasing the strength and modulus of amine-cured epoxy resins
    • Daly J., Britten A., Garton A., An additive for increasing the strength and modulus of amine-cured epoxy resins, J. Appl. Polym. Sci., 29, 1403-1414, 1984.
    • (1984) J. Appl. Polym. Sci. , vol.29 , pp. 1403-1414
    • Daly, J.1    Britten, A.2    Garton, A.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.