Effect of bismaleimide resin on curing kinetics of epoxy-amine thermosets

Journal of Applied Polymer Science

Volumn 62, Issue 4, 1996, Pages 661-671

  Chandra, R ^a   Rajabi, L ^a   Soni, R K ^a  

^a DELHI TECHNOLOGICAL UNIVERSITY   (India)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; AGENTS; AMINES; COMPUTER SOFTWARE; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ENTHALPY; EPOXY RESINS; ORGANIC POLYMERS; SUBSTITUTION REACTIONS; THERMOSETS;

AROMATIC DIAMINES; BISMALEIMIDE RESIN; BISMALEIMIDODIPHENYLMETHANE; BISPHENOL A; CURING KINETICS; DIAMINODIPHENYL SULFONE; DIGLYCIDYL ETHER; EPOXY AMINE THERMOSETS; KINETIC PARAMETERS; METHYLENEDIANILINE;

REACTION KINETICS;

EID: 0030270802     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/(SICI)1097-4628(19961024)62:4<661::AID-APP10>3.0.CO;2-Z     Document Type: Article

References (17)