Wafer thinning solution for wafer-level-capped MEMS devices

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1118-1121

  Lacsamana, E S ^a   Mena, M G ^a   Navarre, R M ^a   Kuan, N ^a   Spooner, T R ^a  

^a ANALOG DEVICES INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELEROMETERS; ELECTRONICS PACKAGING; GRINDING (MACHINING); MICROPROCESSOR CHIPS; TAPES;

BACKGRINDING MACHINES; LEADFRAME CHIP SCALE PACKAGE (LFCSP); THINNED CAPPED ACCELEROMETERS; WAFER PROTECTIVE TAPES;

MICROELECTROMECHANICAL DEVICES;

EID: 33845595107     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645793     Document Type: Conference Paper

References (8)

1. T.A. Core, W.K. Tsang, and S.J. Sherman, "Fabrication Technology for an Integrated Surface Micromachined Sensor," Solid State Technology, Oct 1993, pp. 39-47.
2. F. Shemansky, et. al, "A two-chip accelerometer system for automotive applications," Microsyst. Technol., vol. 1, no. 3, pp. 121-125, 1997
3. Felton, L.E., Duffy, M., Hablutzel, N., Farrell, P.W. and Webster, W.A. Low-Cost Packaging of Inertial MEMS Devices. Proc. 36th International Symposium on Microelectronics, Boston, MA, Nov 2003, pp. 402-406
4. Felton, L.E., Hablutzel, N., Harney, K.P. and Webster, W.A. Chip Scale Packaging of a MEMS Accelerometer. Proceedings of the Electronic Component and Technology Conference, Florida, June 2004, pp. 870-873
5. C.M. Roberts Jr., L.H. Long, and P.A. Ruggerio, "Method for separating circuit dies from a wafer," U.S. Patent 5362681, Nov. 1994
6. C. Landesgerger et al, New Process Scheme for Wafer Thinning and Stress-free Separation of Ultra Thin ICs. Proceedings of Microsystems Technologies 2001, Mesago, Stuttgart, pp. 431-436
7. Tetsuo Satoh, "Method for Manufacturing Chip-Scale Package and Manufacturing IC Chip," U.S. Patent 6338980, January 2002
8. Kessel, C. R. et al, Wafer Thinning with the 3M Wafer Support System. Wafer-Level Congress and Exhibition Conference Proceedings, Oct. 2004 (www.smta.org)