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1
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24644514491
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Development and application of innovational drop impact modeling techniques
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Tee, T.Y.1
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2
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3
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0038013577
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Solder joint behavior of area array packages in board level drop for handheld devices
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New Orleans, LA, May
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rd Electronic Components and Technology Conf, New Orleans, LA, May. 2003, pp. 130-135.
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(2003)
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Xie, D.1
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4
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Estimation of fall impact strength for BGA solder joints
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Mishiro, K.1
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7
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2942749105
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JEDEC Standard JESD22-B11
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(2003)
Joint Electron Device Engineering Council
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8
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0038351732
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Modeling technique for reliability assessment of portable electronic product subjected to drop impact loads
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New Orleans, LA, May
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rd Electronic Components and Technology Conf, New Orleans, LA, May. 2003, pp. 100-104.
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(2003)
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Zhu, L.1
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9
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Global and local coupling analysis for small components in drop simulation
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Detroit, MI, April
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th International LS-DYNA Users Conf, Detroit, MI, April. 2000, pp. 11:17-11:26.
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Wu, J.1
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10
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Transition analysis of board-level drop response of lead-free chip-scale package with experimental verifications
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Singapore, Dec.
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th Electronic Packaging Technology Conf, Singapore, Dec. 2005, pp. 695-700.
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(2005)
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Yeh, C.L.1
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11
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24644454370
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Parametric investigation of dynamic behavior of FBGA solder joints in board-level drop simulation
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Orlando, FL, May
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th Electronic Components and Technology Conf, Orlando, FL, May. 2005, pp. 499-503.
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(2005)
th Electronic Components and Technology Conf
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Groothuis, S.1
Chen, C.2
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12
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24644473712
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A methodology for drop performance prediction and application for design optimization of chip scale packages
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Orlando, FL, May
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th Electronic Components and Technology Conf, Orlando, FL, May. 2005, pp. 472-479.
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Syed, A.1
Kim, S.M.2
Lin, W.3
Khim, J.Y.4
Song, E.S.5
Shin, J.H.6
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