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Volumn 2006, Issue , 2006, Pages 422-427

Drop test simulation and DOE analysis for design optimization of microelectronics packages

Author keywords

[No Author keywords available]

Indexed keywords

DESIGN OF EXPERIMENT (DOE); DIE ATTACH (DA); DROP TEST SIMULATION; INTERFACIAL PEELING STRESS; LAND GRID ARRAY (LGA);

EID: 33845594757     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645681     Document Type: Conference Paper
Times cited : (20)

References (12)
  • 2
    • 2942740958 scopus 로고    scopus 로고
    • Impact life prediction modeling of TFBGA packages under board level drop test
    • Tee, T.Y., Ng, H.S., Lim, C.T., Pek, E., and Zhong, Z., "Impact Life Prediction modeling of TFBGA Packages under Board Level Drop Test," Microelectronics Reliability Jouranl, Vol. 44, (2004), pp. 1131-1142.
    • (2004) Microelectronics Reliability Jouranl , vol.44 , pp. 1131-1142
    • Tee, T.Y.1    Ng, H.S.2    Lim, C.T.3    Pek, E.4    Zhong, Z.5
  • 5
    • 0036134475 scopus 로고    scopus 로고
    • Effect of the drop impact on BGA/CSP package reliability
    • Mishiro, K., "Effect of the Drop Impact on BGA/CSP Package Reliability," Microelectronics Reliability Jouranl, Vol. 42, (2002), pp. 77-82.
    • (2002) Microelectronics Reliability Jouranl , vol.42 , pp. 77-82
    • Mishiro, K.1
  • 7
    • 2942749105 scopus 로고    scopus 로고
    • Board level drop test method of components for handheld electronic products
    • JEDEC Standard JESD22-B11
    • JEDEC Standard JESD22-B11, "Board Level Drop Test Method of Components for Handheld Electronic Products," Joint Electron Device Engineering Council, 2003.
    • (2003) Joint Electron Device Engineering Council
  • 8
    • 0038351732 scopus 로고    scopus 로고
    • Modeling technique for reliability assessment of portable electronic product subjected to drop impact loads
    • New Orleans, LA, May
    • rd Electronic Components and Technology Conf, New Orleans, LA, May. 2003, pp. 100-104.
    • (2003) rd Electronic Components and Technology Conf , pp. 100-104
    • Zhu, L.1
  • 9
    • 0004394160 scopus 로고    scopus 로고
    • Global and local coupling analysis for small components in drop simulation
    • Detroit, MI, April
    • th International LS-DYNA Users Conf, Detroit, MI, April. 2000, pp. 11:17-11:26.
    • (2000) th International LS-DYNA Users Conf
    • Wu, J.1
  • 10
    • 28444441992 scopus 로고    scopus 로고
    • Transition analysis of board-level drop response of lead-free chip-scale package with experimental verifications
    • Singapore, Dec.
    • th Electronic Packaging Technology Conf, Singapore, Dec. 2005, pp. 695-700.
    • (2005) th Electronic Packaging Technology Conf , pp. 695-700
    • Yeh, C.L.1    Lai, Y.S.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.