Moisture diffusion behavior in bismaleimide resin subjected to hygrothermal cycling

Polymer Engineering and Science

Volumn 42, Issue 2, 2002, Pages 375-381

  Li, Yanmei ^a   Miranda, John ^a   Sue, Hung Jue ^a  

^a Texas AandM University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ABSORPTION; DESORPTION; DIFFUSION IN SOLIDS; DYNAMIC MECHANICAL ANALYSIS; MOLECULAR STRUCTURE; SWELLING;

BISMALEIMIDE RESIN; HYGROTHERMAL CYCLING; MOISTURE DIFFUSION;

ORGANIC POLYMERS;

EID: 0036465308     PISSN: 00323888     EISSN: None     Source Type: Journal    
DOI: 10.1002/pen.10955     Document Type: Article

References (20)

1. Hygrothermal diffusion behavior in bismaleimide resin