Automotive applications for micromachining

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3223, Issue , 1997, Pages 218-222

  Sparks, Douglas R ^a   Chang, Shih Chia ^b  

^a DELPHI CORPORATION   (United States)

^b GM Research Lab   (United States)

Author keywords

Accelerometer; Angular rate sensor; Etching; LIGA; Micromachine; Nozzle; Pressure sensor; Silicon; Valve; Wafer bonding

Indexed keywords

ANGULAR RATE SENSOR; AUTOMOTIVE APPLICATIONS; CIRCUIT INTEGRATIONS; FUTURE APPLICATIONS; LIGA; MICROMACHINE; SILICON MICROMACHINING; VALVE;

ACCELEROMETERS; APPLICATIONS; AUTOMOTIVE INDUSTRY; CHIP SCALE PACKAGES; COMPOSITE MICROMECHANICS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; ETCHING; MACHINING; MICROANALYSIS; MICROFABRICATION; MICROMACHINING; NOZZLES; PLASMA ETCHING; PRESSURE SENSORS; PRESSURE TRANSDUCERS; SEMICONDUCTING SILICON COMPOUNDS; SENSORS; SILICON WAFERS; WET ETCHING;

WAFER BONDING;

EID: 33845361743     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.284483     Document Type: Conference Paper

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