SCOPUS 정보 검색 플랫폼

Volumn 41, Issue 21, 2006, Pages 7197-7209

Reaction kinetics and mechanical properties in the reactive brazing of copper to aluminum nitride

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; COPPER; ELECTRIC CONDUCTIVITY; ELECTRONICS PACKAGING; METALLIZING; MICROSTRUCTURE; REACTION KINETICS; THERMAL CONDUCTIVITY;

BRAZED JOINTS; REACTIVE METAL; THICKENING KINETICS;

BRAZING;

EID: 33751531777 PISSN: 00222461 EISSN: 15734803 Source Type: Journal
DOI: 10.1007/s10853-006-0920-z Document Type: Conference Paper

Times cited : (27)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.