Using nanoindentation and nanoscratch to determine thin film mechanical properties

Key Engineering Materials

Volumn 326-328 I, Issue , 2006, Pages 357-360

  Chang, Rwei Ching ^a   Chen, Feng Yuan ^b   Sun, Chang En ^a  

^a ST JOHN'S UNIVERSITY   (Taiwan)

^b LEE MING INSTITUTE OF TECHNOLOGY   (Taiwan)

Author keywords

Mechanical properties; Nanoindentation, nanoscratch; Substrate; Thin films

Indexed keywords

COPPER; DEPOSITION; ELASTIC MODULI; EVAPORATION; MECHANICAL PROPERTIES; NANOTECHNOLOGY; PHYSICAL VAPOR DEPOSITION; SILICON WAFERS; SUBSTRATES;

COPPER THIN FILMS; HEATING EVAPORATOR; NANOINDENTATION; NANOSCRATCH;

THIN FILMS;

EID: 33751505553     PISSN: 10139826     EISSN: 16629795     Source Type: Book Series    
DOI: 10.4028/0-87849-415-4.357     Document Type: Conference Paper

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