Low-temperature direct flip-chip bonding for integrated micro-systems

Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS

Volumn 2005, Issue , 2005, Pages 121-122

  Higurashi, E ^a   Suga, T ^b   Sawada, R ^c  

^a UNIVERSITY OF TOKYO   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

^c KYUSHU UNIVERSITY   (Japan)

Author keywords

Flip chip bonding; Hybrid Integration; Surface Activated bonding; VCSEL

Indexed keywords

FLIP-CHIP BONDING; HYBRID INTEGRATION; SURFACE ACTIVATED BONDING; VCSEL;

ELECTRODES; INTEGRATED OPTICS; LASER PULSES; LOW TEMPERATURE OPERATIONS; MICROOPTICS; PLASMA WAVES; SHEAR STRENGTH; SILICON;

FLIP CHIP DEVICES;

EID: 33751323440     PISSN: 10928081     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/LEOS.2005.1547908     Document Type: Conference Paper

References (3)

1. E. Higurashi, R. Sawada, and T. Ito, J. Lightwave Tech., 21, 591-595 (2003).
2. E. Higurashi and R. Sawada, J. Micromech. Microeng., 15, 1459-1465 (2005).
3. T. Suga, T. Itoh, Z. Xu, M. Tomita, and A. Yamauchi, Proc. of Electronic Components and Technology Conference (52nd ECTC), 105-111 (2002).