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Volumn 2005, Issue , 2005, Pages 396-401

One-sided anchored structures for the realization of conical spiral antennas

Author keywords

Bi metal coating; Conical spiral antennas; Out of plane; Three dimensional on chip structures

Indexed keywords

BIMETALS; CHROMIUM; COMPUTER SIMULATION; DEPOSITION; NICKEL; STRESS ANALYSIS;

EID: 33751305591     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (1)

References (12)
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  • 8
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    • Processability and electrical characteristics of glass substrates for RF wafer-level chip-scale packages
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    • A. Polyakov, P.M. Mendes, S.M. Sinaga, M. Bartek, B. Rejaei, Correia, J.N. Burghartz, J.H, Processability and Electrical Characteristics of Glass Substrates for RF Wafer-Level Chip-Scale Packages. Proc. ECTC 2003, New Orleans, USA, May 27-30, 2003.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.