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Volumn 2003-January, Issue , 2003, Pages 128-133

Distributed electrothermal modeling in VHDL-AMS

Author keywords

Circuit simulation; Coupling circuits; Difference equations; Electrothermal effects; Finite difference methods; Resistors; Silicon; Solid modeling; Temperature sensors; Thermal resistance

Indexed keywords

BEHAVIORAL RESEARCH; CIRCUIT SIMULATION; COUPLED CIRCUITS; DIFFERENCE EQUATIONS; ELECTRIC HEATING; HEAT RESISTANCE; RESISTORS; SILICON; TEMPERATURE SENSORS;

EID: 33751263833     PISSN: 21603804     EISSN: 21603812     Source Type: Conference Proceeding    
DOI: 10.1109/BMAS.2003.1249871     Document Type: Conference Paper
Times cited : (7)

References (20)
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  • 4
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  • 6
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    • Simulating the dynamic electrothermal behavior of power electronic circuits and systems
    • October
    • A. R. Hefner and D. L. Blackburn, "Simulating the dynamic electrothermal behavior of power electronic circuits and systems," IEEE Transactions on Power Electronics, vol. 8, pp. 376-385, October 1993.
    • (1993) IEEE Transactions on Power Electronics , vol.8 , pp. 376-385
    • Hefner, A.R.1    Blackburn, D.L.2
  • 9
    • 0035691287 scopus 로고    scopus 로고
    • Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems
    • December
    • W. Batty, C. E. Christoffersen, A. J. Panks, S. David, C. M. Snowden, and M. B. Steer, "Electrothermal CAD of power devices and circuits with fully physical time-dependent compact thermal modeling of complex nonlinear 3-d systems," IEEE Transactions on Components and Packaging Technologies, vol. 24, pp. 566-590, December 2001.
    • (2001) IEEE Transactions on Components and Packaging Technologies , vol.24 , pp. 566-590
    • Batty, W.1    Christoffersen, C.E.2    Panks, A.J.3    David, S.4    Snowden, C.M.5    Steer, M.B.6
  • 14
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    • VHDL-AMS design objectives and rationale
    • Kluwer Academic Publishers
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    • (1995) Current Issues in Electronic Modeling , vol.2 , pp. 1-30
    • Shi, C.-J.1    Vachoux, A.2
  • 18
    • 0030247516 scopus 로고    scopus 로고
    • A rational formulation of thermal circuit models for electrothermal simulation - Part I: Finite element method; part II: Model reduction techniques
    • J. T. Hsu and L. Vu-Quoc, "A rational formulation of thermal circuit models for electrothermal simulation - part I: Finite element method; part II: Model reduction techniques," IEEE Transactions on Circuits and Systems, vol. 43, no. 9, pp. 721-744, 1996.
    • (1996) IEEE Transactions on Circuits and Systems , vol.43 , Issue.9 , pp. 721-744
    • Hsu, J.T.1    Vu-Quoc, L.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.