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AIP Conference Proceedings

Volumn 817, Issue , 2006, Pages 277-287

Temperature-dependent stress measurements at inlaid copper interconnect lines

(6) Geisler, H a Prinz, H a Zienert, I a Rinderknecht, J a Kiene, M a Zschech, E a

a IBM MICROELECTRONICS (United States)

Author keywords

Copper interconnects; Low k; SiO2; Stress; Synchrotron; Temperature; X ray diffraction

Indexed keywords

EID: 33751231427 PISSN: 0094243X EISSN: 15517616 Source Type: Conference Proceeding
DOI: 10.1063/1.2173560 Document Type: Conference Paper

Times cited : (8)

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