Reduction of fabricational thermal residual stress of the hybrid co-cured structure using a dielectrometry

Composites Science and Technology

Volumn 67, Issue 1, 2007, Pages 29-44

  Kim, Hak Sung ^a   Lee, Dai Gil ^a  

^a Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

A. Co cured metal composite hybrid structure; C. Cure kinetic model; D. Dielectrometry; D. Fabricational thermal residual stress; E. Cure control

Indexed keywords

ALGORITHMS; CARBON FIBERS; COMPOSITE MATERIALS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; EPOXY RESINS; METALS; THERMAL STRESS;

CO-CURED STEEL/COMPOSITE STRIP; CURE CONTROL SYSTEM; CURE KINETIC MODEL; DIELECTROMETRY;

COMPOSITE STRUCTURES;

CALORIMETRY; CARBON FIBER; DIELECTRIC PROPERTY; FIBER REINFORCED COMPOSITE; MATHEMATICAL ANALYSIS; MATHEMATICAL MODEL; SHEAR PROPERTY; STRESS; THERMAL PROPERTY;

EID: 33751203244     PISSN: 02663538     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compscitech.2006.05.002     Document Type: Article

References (12)

1. Lee D.G., Hwang H.Y., and Kim J.K. Design and manufacturing of a carbon fiber epoxy rotating boring bar. Compos Struct 60 (2003) 115-124
2. Kim H.S., and Lee D.G. Optimal design of the press fit joint for a hybrid aluminum/composite drive shaft. Compos Struct 63 (2004) 87-99
3. Cho D.H., and Lee D.G. Optimum design of co-cured steel-composite tubular joints under axial load. J Adhes Sci Technol 14 (2000) 939-963
4. Hodges J., Yates B., Darby M.I., Wostenholm G.H., Clement J.F., and Keates T.F. Residual stresses and the optimum cure cycle for an epoxy resin. J Mater Sci 24 (1989) 1984-1990
5. White S.R., and Hahn H.T. Cure cycle optimization for the reduction of processing-induced residual stresses in composite materials. J Compos Mater 27 (1993) 1352-1378
6. Kim HS, Park SW, Lee DG. Smart cure cycle with cooling and reheating for cocure bonded steel/carbon epoxy composite hybrid structure to reduce the fabricating thermal residual stress. Compos Part A [in press].
7. Kim J.S., and Lee D.G. Measurement of the degree of cure of carbon fiber epoxy composite materials. J Compos Mater 30 (1996) 1436-1457
8. Kwon J.W., Chin W.S., and Lee D.G. In situ cure monitoring of adhesively bonded joints by dielectrometry. J Adhes Sci Technol 16 (2003) 2111-2130
9. Runt J.P., and Fitzgerald J.J. Dielectric spectroscopy of polymeric materials fundamentals and applications (1997), American Chemical Society, Washington
10. Yalof SA, Brisbin DC. The relationship between dielectric and mechanical properties of polymers. In: Proceedings of the 4th international SAMPE symposium. p. 391-7.
11. Ungarish M.R., Joseph R., Vittoser J., and Kenig S. Cur cycle optimization of composites by dielectric measurements. Composites 21 (1990) 481-486
12. Timoshenko S.P. The collected papers (1953), McGraw-Hill, Newyork