In situ cure monitoring of adhesively bonded joints by dielectrometry

Journal of Adhesion Science and Technology

Volumn 17, Issue 16, 2003, Pages 2111-2130

  Kwon, Jae Wook ^a   Chin, Woo Seok ^b   Lee, Dai Gil ^b  

^a LG Electronics Inc   (South Korea)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Adhesively bonded joint; Dielectrometry; Differential scanning calorimetry; On line cure monitoring; Self sensor

Indexed keywords

CURING; DIFFERENTIAL SCANNING CALORIMETRY; ELECTRIC VARIABLES MEASUREMENT; ELECTRODES; RELIABILITY; SENSORS; STEEL; THERMAL EFFECTS; ADHESIVE JOINTS; THERMOSETS;

ADHESIVELY BONDED JOINT; ADHESIVELY BONDED JOINTS; DIELECTROMETRY; ON LINE CURE MONITORING; SELF SENSOR;

ADHESIVE JOINTS; CURING;

ADHERENDS; ADHESIVELY BONDED JOINTS; CURE MONITORING; CURE PARAMETER; CURE RATE; DEGREE OF CURE; DIELECTRIC METHODS; DIELECTROMETRY; DISSIPATION FACTORS; IN-SITU; SELF-SENSOR;

EID: 1342333666     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856103772150733     Document Type: Article

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