Dissolution profile of tool material into chip lattice

Journal of Manufacturing Science and Engineering

Volumn 128, Issue 4, 2006, Pages 928-937

  Wong, Tim K ^a   Kwon, Patrick ^a  

^a Michigan State University   (United States)

Author keywords

Advection diffusion reaction equations; Decomposition of tool; Dissolution wear; Frank Turnbull mechanism

Indexed keywords

BOUNDARY CONDITIONS; COMPUTER SIMULATION; DECOMPOSITION; DIFFUSION; FINITE ELEMENT METHOD; MASS TRANSFER; PROBLEM SOLVING;

ADVECTION DIFFUSION REACTION EQUATIONS; DECOMPOSITION OF TOOLS; DISSOLUTION WEAR; FRANK TURNBULL MECHANISM;

WEAR OF MATERIALS;

EID: 33751085386     PISSN: 10871357     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.2280680     Document Type: Article

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