Thermal stress evaluation of a PCRAM material Ge2Sb 2Te5

21st IEEE Non-Volatile Semiconductor Memory Workshop 2006, NVSMW 2006

Volumn 2006, Issue , 2006, Pages 97-98

  Chen, K N ^a   Krusin Elbaum, L ^a   Cabrai Jr , C ^a   Lavoie, C ^a   Sun, J ^a   Rossnagel, S ^a  

^a IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 33751063815     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/.2006.1629511     Document Type: Conference Paper

References (3)

1. S. Lai and T. Lowrey, IEDM Tech. Dig., pp. 803-806, 2001
2. T. P. Leervard Pedersen et al, Applied Physics Letters 79, pp. 3597-3599, 2001.
3. M. H. R. Lankhorst et al, Nature Materials 4, pp. 347-352, 2005.