Design and analysis of low cost IC package solution for 10 Gbit/s applications

IEEE MTT-S International Microwave Symposium Digest

Volumn 1, Issue , 2001, Pages 1899-1902

  Megahed, Mohamed ^a   Zilaro, Patrick ^a   Khaw, Mike ^a  

^a Rockwell Semiconductor Systems   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; FREQUENCY DOMAIN ANALYSIS; IMPEDANCE MATCHING (ELECTRIC); INTEGRATED CIRCUIT LAYOUT; INTEGRATED CIRCUIT TESTING; TIME DOMAIN ANALYSIS;

INTEGRATED CIRCUIT PACKAGE SOLUTION; LAMINATE BASED PACKAGE; LAND GRID ARRAY; WIREBOND TECHNOLOGY;

ELECTRONICS PACKAGING;

EID: 0035683099     PISSN: 0149645X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MWSYM.2001.967279     Document Type: Article

References (1)

1. High performance 10Gbit/s optical receiver using APD and highly integrated HBT Ics with PLL