A novel method of composite electroplating on lap in lapping process

International Journal of Machine Tools and Manufacture

Volumn 47, Issue 2, 2007, Pages 361-367

  Chiou, Yuang Cherng ^a   Lee, Rong Tsong ^a   Yau, Chang Li ^a  

^a NATIONAL SUN YAT SEN UNIVERSITY   (Taiwan)

Author keywords

Composite electroplating; Dress; Lapping process; Silicon wafer

Indexed keywords

CATHODES; COMPOSITE MATERIALS; CURRENT DENSITY; LAPPING MACHINES; MIRRORS; SILICON WAFERS; SURFACE ROUGHNESS; TINNING;

COMPOSITE ELECTROPLATING; LAPPING PROCESSES; WEAR RATES;

ELECTROPLATING;

EID: 33750945618     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2006.03.003     Document Type: Article

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