Wettability of TiAlN films by molten aluminum

Thin Solid Films

Volumn 515, Issue 4, 2006, Pages 2009-2014

  Shen, Ping ^a,b   Nose, Masateru ^c   Fujii, Hidetoshi ^a   Nogi, Kiyoshi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b Jilin University   (China)

^c UNIVERSITY OF TOYAMA   (Japan)

Author keywords

Adhesion; Interfaces; Oxidation; Wetting

Indexed keywords

ADHESION; ALUMINUM; INTERFACES (MATERIALS); OXIDATION; SINGLE CRYSTALS; THIN FILMS;

SESSILE DROP METHOD; TIALN FILMS; TUNGSTEN SUBSTRATES;

TITANIUM COMPOUNDS;

EID: 33750810614     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.04.036     Document Type: Article

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