Rheology of CuO nanoparticle suspension prepared by ASNSS

Reviews on Advanced Materials Science

Volumn 10, Issue 2, 2005, Pages 128-132

  Chang, Ho ^a   Jwo, C S ^a   Lo, C H ^a   Tsung, T T ^a   Kao, M J ^a   Lin, H M ^b  

^a NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY   (Taiwan)

^b TATUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTROSTATICS; NANOSTRUCTURED MATERIALS; NANOTECHNOLOGY; PARTICLE SIZE ANALYSIS; PH; RHEOLOGY; SHEAR STRENGTH; SURFACE PROPERTIES; SUSPENSIONS (FLUIDS); SYNTHESIS (CHEMICAL); VISCOSITY;

ARC-SUBMERGED NANOPARTICLE SYNTHESIS SYSTEM (ASNSS); ELECTROSTATIC FORCE; ISOELECTRIC POINT; NANOFLUID; SPECIFIC SURFACE AREA;

COPPER OXIDES;

EID: 24744471387     PISSN: 16065131     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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