Design and analysis of a smart composite pipe joint system integrated with piezoelectric layers under bending

International Journal of Solids and Structures

Volumn 44, Issue 1, 2007, Pages 298-319

  Cheng, Jinquan ^a,b   Wu, Xiaoxia ^b   Li, Guoqiang ^a   Pang, Su Seng ^a   Taheri, Farid ^b  

^a LOUISIANA STATE UNIVERSITY   (United States)

^b DALHOUSIE UNIVERSITY   (Canada)

Author keywords

Adhesive; Composite; Piezoelectrics; Pipe joint; Smart materials and structures; Stress analysis

Indexed keywords

ADHESIVES; ELECTRIC FIELDS; INTELLIGENT MATERIALS; INTELLIGENT STRUCTURES; PIEZOELECTRIC MATERIALS; STRESS ANALYSIS;

ADHESIVE LAYERS; ELECTRO-MECHANICAL MODELS; PIEZOELECTRICS;

PIPE JOINTS;

EID: 33750720951     PISSN: 00207683     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijsolstr.2006.04.021     Document Type: Article

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