A novel smart adhesively bonded joint system

Smart Materials and Structures

Volumn 14, Issue 5, 2005, Pages 971-981

  Cheng, Jinquan ^a   Taheri, Farid ^a  

^a DALHOUSIE UNIVERSITY   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC FIELD EFFECTS; ELECTROMECHANICAL DEVICES; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; PIEZOELECTRIC MATERIALS; STRESS CONCENTRATION;

ADHESIVE LAYER; ADHESIVELY JOINT SYSTEM; PIEZOELECTRIC PATCHES;

ADHESIVES;

EID: 25144501607     PISSN: 09641726     EISSN: None     Source Type: Journal    
DOI: 10.1088/0964-1726/14/5/035     Document Type: Conference Paper

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