Nanocrystalline Ni-B coating surface strengthening pure copper

Applied Surface Science

Volumn 253, Issue 3, 2006, Pages 1051-1054

  Ziyuan, Shi ^a   Deqing, Wang ^a   Zhimin, Ding ^a  

^a DALIAN JIAOTONG UNIVERSITY   (China)

Author keywords

Amorphous; Electroless deposition; Nanocrystalline Ni B coating; Pure copper

Indexed keywords

ELECTROLESS PLATING; GRAIN SIZE AND SHAPE; HARDENING; HEAT TREATMENT; MICROSTRUCTURE; NICKEL COMPOUNDS; SYNTHESIS (CHEMICAL);

HARDENING LAYERS; NANOCRYSTALLINE NI-B COATING; PURE COPPER;

NANOSTRUCTURED MATERIALS;

EID: 33750703947     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2005.12.169     Document Type: Article

References (11)

1. Ziyuan S., and Deqing W. J. Mater. Sci. Lett. 17 6 (1998) 477
2. Bhat D.G., Rebenne H.E., and Strandberg C. J. Mater. Sci. 26 7 (1991) 4567
3. Feldslein M.D. Plat. Surf. Finish. 85 3 (1998) 248
4. Himbeault D.D., Varin R.A., and Piekarski K. Metall. Trans. A 19A 8 (1988) 2109
5. Abraham S., Pai B.C., Satyanarayana K.G., and Vaidyan V.K. J. Mater. Sci. 25 8 (1990) 2839
6. Kazimierzak B. Mater. Des. 13 2 (1992) 67
7. Fromont R.I. Mater. Process. Rep. 7 2 (1992) 2
8. Kupp E.R., Drawl W.R., and Spear K.E. Surf. Coat. Technol. 68 (1994) 378
9. Shriram S., et al. Trans. IMF 78 5 (2000) 194
10. Ziyuan S., et al. Appl. Surf. Sci. 221 (2004) 62
11. Scherrer P. Nachr (Göttingen) 2 (1918) 98