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Volumn 441, Issue 1-2, 2006, Pages 282-290
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Diminishing of work hardening in electroformed polycrystalline copper with nano-sized and uf-sized twins
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Author keywords
Cell structures; Copper; Dislocations; Mechanical properties; Nano and ultrafine sized; Twin; Work hardening
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Indexed keywords
COPPER;
CREEP;
CRYSTAL MICROSTRUCTURE;
DEFORMATION;
DISLOCATIONS (CRYSTALS);
ELECTROFORMING;
MECHANICAL PROPERTIES;
POLYCRYSTALLINE MATERIALS;
TRANSMISSION ELECTRON MICROSCOPY;
CELL STRUCTURES;
NANO-SIZED TWINS;
ULTRAFINE-SIZED TWINS;
STRAIN HARDENING;
COPPER;
CREEP;
CRYSTAL MICROSTRUCTURE;
DEFORMATION;
DISLOCATIONS (CRYSTALS);
ELECTROFORMING;
MECHANICAL PROPERTIES;
POLYCRYSTALLINE MATERIALS;
STRAIN HARDENING;
TRANSMISSION ELECTRON MICROSCOPY;
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EID: 33750608761
PISSN: 09215093
EISSN: None
Source Type: Journal
DOI: 10.1016/j.msea.2006.08.051 Document Type: Article |
Times cited : (96)
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References (34)
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