Nonlinear thermal bending response of FGM plates due to heat conduction

Composites Part B: Engineering

Volumn 38, Issue 2, 2007, Pages 201-215

  Shen, Hui Shen ^a,b,c  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b Shanghai Jiao Tong University   (China)

^c LANZHOU UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

A. Plates; C. Analytical modelling; Functionally graded materials; Heat conduction

Indexed keywords

ACTUATORS; ELECTRIC LOADS; FUNCTIONALLY GRADED MATERIALS; HEAT CONDUCTION; PIEZOELECTRIC DEVICES; THERMOANALYSIS;

ANALYTICAL MODELING; GOVERNING EQUATIONS; PIEZOELECTRIC ACTUATORS; THERMAL BENDING;

BENDING (DEFORMATION);

EID: 33750608559     PISSN: 13598368     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesb.2006.06.004     Document Type: Article

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