Antenna-in-Package technology for modern radio systems

2006 IEEE International Workshop on Antenna Technology, IWAT 2006 - Small Antennas and Novel Metamaterials

Volumn 2006, Issue , 2006, Pages 37-40

  Zhang, Y P ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND NETWORKS; CERAMIC MATERIALS; MILLIMETER WAVES; MOUNTINGS; RADIO SYSTEMS;

ANTENNA-IN-PACKAGE TECHNOLOGY; LOW TEMPERATURE COFIRED CERAMIC (LTCC); SINGLE CHIP RADIOS; ULTRAWIDE BAND (UWB);

ANTENNAS;

EID: 33750212857     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IWAT.2006.1608969     Document Type: Conference Paper

References (13)

1. A. R. Behzad, M. S. Zhong, S. B. Anand, L. Li, K. A. Carter, M. S. Kappes, T. H. Lin, T. Nguyen, D. Yuan, S. Wu, Y. C. Wong, V. Gong, A. Rofougaran, "A 5-GHz direct-conversion CMOS transceiver utilizing automatic frequency control for the IEEE 802.11a wireless LAN standard," IEEE J. of Solid-State Circuits, vol. 38, no. 12, pp. 2209-2220, 2003.
2. P. M. Mendes, S. Sinaga, A. Polyakov, M. Bartek, J. N. Burghartz, J. H. Correia, "Wafer-level integration of on-chip antennas and RF passives using high-resistivity polysilicon substrate technology," Electronic Components and Technology Conference, pp. 1879-1884, 2004
3. H. Tanidokoro, N. Konishi, E. Hirose, Y. Shinokara, H. Arai, N. Goto, "1-wavelength loop type dielectric chip antenna," in Proc. IEEE Int. AP-S Symp., 1998, pp. 1950-1953.
4. Y. Dakeya, T. Suesada, K. Asakura, N. Nakajima, H. Mandai, "Chip multilayer antenna for 2.45 GHz-band application using LTCC technology," in Digest of IEEE Int. MTT-S Int. Symp., 2000, pp. 1693-1696.
5. Y. P. Zhang, "Integration of microstrip antenna on ceramic ball grid array package," IEE Electronics Lett., vol. 38, no. 1, pp. 14-16, 2002.
6. Y. P. Zhang, "Finite-difference Time-domain analysis of an integrated circuit ceramic ball grid array package antenna for single-chip wireless transceivers," IEEE Trans. Antennas and Propagat., vol. 52, No. 2, pp. 435-442, 2004.
7. Y. P. Zhang, "Integrated circuit ceramic ball grid array package antenna," IEEE Trans. Antennas and Propagat., vol. 52, no. 10, pp. 2538-2544, 2004.
8. C. C. Zhang, J. J. Liu, Y. P. Zhang, "ICPA for highly integrated concurrent dual-band wireless receivers," IEE Electronics Letters, Vol. 39, No. 12, pp. 887-889, 2003.
9. W. Wang, Y. P. Zhang, "0.18-μm CMOS push-pull power amplifier with antenna in IC package," IEEE Microwave and Wireless Components Letters, Vol. 14, No. 1, pp. 13-15, 2004.
10. J. J. Wang, Y. P. Zhang, K. M. Chua, A. C. W. Lu, "Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers," IEEE Trans. Antennas and Propagat., vol. 53, No. 12, pp. 3877-3883, 2005.
11. Y. Chen, Y. P. Zhang, "A planar antenna in LTCC for single-package Ultrawide-band radio," IEEE Trans. Antennas and Propagat., vol. 53, No. 9, pp. 435-442, 2005.
12. Y. Chen, G. Y. Li, Y. P. Zhang, "An LTCC planar ultra-wideband antenna," Microwave and Optical Technology Letters, Vol. 42, No. 3, pp. 220-222, August 2004.
13. L. Desclos, "V-band double-slot antenna integration on LTCC substrate using thick-film technology," Microwave and Optical Technology Letters, Vol. 28, No. 5, pp. 354-357, March 2001.