Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers

IEEE Transactions on Antennas and Propagation

Volumn 53, Issue 12, 2005, Pages 3877-3883

  Wang, J J ^a   Zhang, Y P ^a   Chua, Kai Meng ^b   Lu, Albert Chee Wai ^b  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

Author keywords

Ceramic land grid array package (CLGA); Circuit model for antenna chip codesign; Integrated circuit package antenna (ICPA); Low temperature co fired ceramic (LTCC) technology; Single chip radio frequency (RF) transceivers

Indexed keywords

COMPUTER AIDED DESIGN; COMPUTER SIMULATION; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT LAYOUT; MATHEMATICAL MODELS; METHOD OF MOMENTS; PERMITTIVITY MEASUREMENT; TRANSCEIVERS;

CERAMIC LAND GRID ARRAY PACKAGE (CLGA); CIRCUIT MODEL FOR ANTENNA-CHIP CODESIGN; INTEGRATED CIRCUIT PACKAGE ANTENNA (ICPA); LOW TEMPERATURE CO-FIRED CERAMIC (LTCC) TECHNOLOGY; MICROSTRIP PATCH ANTENNA; SINGLE-CHIP RADIO-FREQUENCY (RF) TRANSCEIVERS;

MICROSTRIP ANTENNAS;

EID: 29444455509     PISSN: 0018926X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TAP.2005.859907     Document Type: Article

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