Evolution of microstructure of Sn-Ag-Cu lead-free flip chip solder joints during aging process

Acta Metallurgica Sinica (English Letters)

Volumn 19, Issue 4, 2006, Pages 301-306

  Tian, Y H ^a   Wang, C Q ^a   Zhou, W F ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Aging; Flip chip; Lead free solder

Indexed keywords

AGING OF MATERIALS; BONDING; EUTECTICS; INTERMETALLICS; MECHANICAL PROPERTIES; MICROSTRUCTURE; SOLDERED JOINTS; SOLDERING ALLOYS;

CHIP INTERCONNECTION PROCESS; FLIP CHIP BONDING; INTERMETALLIC COMPOUNDS; LEAD-FREE FLIP CHIP SOLDER; THERMAL AGING;

FLIP CHIP DEVICES;

EID: 33750200271     PISSN: 10067191     EISSN: None     Source Type: Journal    
DOI: 10.1016/S1006-7191(06)60059-8     Document Type: Article

References (4)

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4. K. Y. Lee, M. Li, D. R. Olsen, W. T. Chen, B. T. C. Tan and S. Mhaisalkar, in 51th Electronic Components and Technology Conference, 2001 Proceedings (IEEE-Institute of Electrical and Electronics Engineers, Orlando, FL, USA, 2001) p.478.