Development of a high-strength high-conductivity Cu-Ni-P alloy. Part I: Characterization of precipitation products

Journal of Electronic Materials

Volumn 35, Issue 10, 2006, Pages 1787-1792

  Murayama, M ^a,c   Belyakov, A ^a   Hara, T ^a   Sakai, Y ^a   Tsuzaki, K ^a   Okubo, M ^b   Eto, M ^b   Kimura, T ^b  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b HITACHI LTD   (Japan)

^c University of Virginia   (United States)

Author keywords

Age hardening; Cu Ni P alloy; Electro conductivity; Nickel phosphide; Precipitation; Transmission electron microscopy (TEM)

Indexed keywords

AGE HARDENING; ELECTRON DIFFRACTION; ENERGY DISPERSIVE SPECTROSCOPY; PHASE DIAGRAMS; PRECIPITATION (CHEMICAL); TRANSMISSION ELECTRON MICROSCOPY;

CU-NI-P ALLOY; ELECTRO-CONDUCTIVITY; NICKEL PHOSPHIDE; PRECIPITATION;

COPPER ALLOYS;

EID: 33750154652     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0158-1     Document Type: Article

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