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Volumn 55, Issue 1, 2006, Pages 193-196

Abrasive polishing assisted nickel electroforming process

Author keywords

Deposition; Hybrid; Nickel

Indexed keywords

ABRASIVES; CERAMIC MATERIALS; CHEMICAL POLISHING; ELECTRODEPOSITION; GRAIN SIZE AND SHAPE; NICKEL; NUCLEATION;

EID: 33750058893     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)60396-5     Document Type: Article
Times cited : (23)

References (12)
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    • Zhu, D.1    Lei, W.N.2    Qu, N.S.3    Xu, H.Y.4
  • 2
    • 0041341918 scopus 로고    scopus 로고
    • Design of electrode profile in electrochemical manufacturing process
    • Zhu, D., Wang, K., Yang, J. M., 2003, Design of Electrode Profile in Electrochemical Manufacturing Process, Annals of the CIRP, 52/1:169-172.
    • (2003) Annals of the CIRP , vol.52 , Issue.1 , pp. 169-172
    • Zhu, D.1    Wang, K.2    Yang, J.M.3
  • 3
  • 4
    • 8744260496 scopus 로고    scopus 로고
    • Electroforming
    • Hart, T., Watson A., 2000, Electroforming, Met. Finish., 98/1:388-399.
    • (2000) Met. Finish. , vol.98 , Issue.1 , pp. 388-399
    • Hart, T.1    Watson, A.2
  • 6
    • 0035715438 scopus 로고    scopus 로고
    • Review on recent advances in electroforming during the last decade
    • Silaimani, S. M., John, S., 2001, Review on Recent Advances in Electroforming During the Last Decade, Bull. Electrochem., 17/12:553-560.
    • (2001) Bull. Electrochem. , vol.17 , Issue.12 , pp. 553-560
    • Silaimani, S.M.1    John, S.2
  • 7
    • 33750050470 scopus 로고    scopus 로고
    • Electroforming process for the fabrication of cryogenic rocket engine thrust chamber
    • Mumbai, India
    • John, S., Veeramani, P., Srinivasan, K. N., 2000, Electroforming Process for the Fabrication of Cryogenic Rocket Engine Thrust Chamber, Mumbai, India, ICEC 18:675-678.
    • (2000) ICEC , vol.18 , pp. 675-678
    • John, S.1    Veeramani, P.2    Srinivasan, K.N.3
  • 8
    • 4644285627 scopus 로고    scopus 로고
    • New electroforming technology pressure aid for LIGA process
    • Tsai, T. H., Yang, H., Chein, R., 2004, New Electroforming Technology Pressure Aid for LIGA Process, Microsystem Technologies, 10:351-356
    • (2004) Microsystem Technologies , vol.10 , pp. 351-356
    • Tsai, T.H.1    Yang, H.2    Chein, R.3
  • 9
    • 0033704218 scopus 로고    scopus 로고
    • Development of electroformed diamond tool with fine grains coated by metal oxide film
    • Semba, T., Sato, H., 2000, Development of Electroformed Diamond Tool with Fine Grains Coated by Metal Oxide Film, Annals of the CIRP, 49/1:57-160.
    • (2000) Annals of the CIRP , vol.49 , Issue.1 , pp. 57-160
    • Semba, T.1    Sato, H.2
  • 11
    • 0026883244 scopus 로고
    • Role of overpotential on texture, morphology and ductility of electrodeposited copper foils for printed circuit board applications
    • Ye, X. P., De Bonte, M., Celis, J. P., Roos, J. R., 1992, Role Of Overpotential on Texture, Morphology and Ductility of Electrodeposited Copper Foils for Printed Circuit Board Applications, J. Electrochem. Soc., 139/6:1592-1600.
    • (1992) J. Electrochem. Soc. , vol.139 , Issue.6 , pp. 1592-1600
    • Ye, X.P.1    De Bonte, M.2    Celis, J.P.3    Roos, J.R.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.