0.25mm-thick CCD packaging for the Dark Energy Survey Camera array

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6276, Issue , 2006, Pages

  Derylo, Greg ^a   Thomas Diehf, H ^a   Estrada, Juan ^a  

^a FERMI NATIONAL ACCELERATOR LABORATORY   (United States)

Author keywords

CCD; Packaging

Indexed keywords

FOCAL PLANE ARRAYS; LAWRENCE BERKELEY NATIONAL LABORATORY (LBNL); WAVELENGTHS;

ALUMINUM NITRIDE; CAMERAS; DATA ACQUISITION; ELECTRONICS PACKAGING; SILICON; TEMPERATURE DISTRIBUTION;

CHARGE COUPLED DEVICES;

EID: 33749589112     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.672505     Document Type: Conference Paper

References (5)

1. B. Flaugher for the DES Collaboration, "The Dark Energy Survey Instrument Design," these proceedings.
2. S.E. Holland, et al., "Fully Depleted, Back-Illuminated Charge-Coupled Devices Fabricated on High-Resistivity Silicon," IEEE Transactions on Electronic Devices 50 (3), 2003.
3. J. Estrada et al., "CCD Testing and Characterization for Dark Energy Survey," these proceedings.
4. H.M. Oluseyi, et al., "LBNL 4-Side Buttable CCD Package Development," Proceedings of SPIE 5301, 2004.
5. R. J. Stover, et al., "Packaging Design for Lawrence Berkeley National Laboratory High Resistivity CCDs," Proceedings of SPIE 5499, 58, 2004.