Cyclo-olefin polymer direct bonding using low temperature plasma activation bonding

Proceedings - 2005 International Conference on MEMS, NANO and Smart Systems, ICMENS 2005

Volumn , Issue , 2005, Pages 346-349

  Mizuno, Jun ^a   Farrens, Sharon ^b   Ishida, Hiroyuki ^c   Dragoi, Viorel ^b   Shinohara, Hidetoshi ^a   Suzuki, Takafumi ^a   Ishizuka, Masanori ^a   Glinsner, Thomas ^b   Shoji, Shuichi ^a  

^a WASEDA UNIVERSITY   (Japan)

^b EV GROUP   (Austria)

^c EV Group Japan KK   (Japan)

Author keywords

Activation; Bonding; COP; Micro channel; Plasma

Indexed keywords

ACTIVATION ENERGY; BONDING; CONTACT ANGLE; DEFORMATION; INTERFACIAL ENERGY; OLEFINS; THERMAL EFFECTS;

CYCLO OLEFIN POLYMERS; PLASMA ACTIVATION BONDING; PLASMA EXPOSURES; RAZOR BLADE METHODS;

ORGANIC POLYMERS;

EID: 33749050342     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICMENS.2005.37     Document Type: Conference Paper

References (2)

1. J. Mizuno, M. Ishizuka, S. Shoji, et al., "Fabrication of Micro-Channel Device by Hot Embossing and Direct Bonding of PMMA", The 2004 International Conference on MEMS, NANO, and Smart Systems, pp. 26-29, Banff, Canada, 2004.
2. W. P. Maszara, G. Goetz, A. Caviglia and J. B. McKitterick, "Bonding of Silicon Wafers for Silicon-on-insulator", J. Appl. Phys., 64, 4943-4950 (1988).