Electrodeposition of particle-strengthened nickel films

Materials Science and Engineering: A

Volumn 234-236, Issue , 1997, Pages 474-476

  Ferkel, H ^a   Muller B ^a   Riehemann, W ^a  

^a CLAUSTHAL UNIVERSITY OF TECHNOLOGY   (Germany)

Author keywords

Dispersion hardening; Electrochemistry; Nanoparticles; Nickel

Indexed keywords

ALUMINA; COERCIVE FORCE; DISPERSION HARDENING; ELECTROCHEMISTRY; ELECTRODEPOSITION; HARDNESS; HEAT TREATMENT; NANOSTRUCTURED MATERIALS; NICKEL; OPTICAL MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

GRAIN STABILIZATION;

METALLIC FILMS;

EID: 0000072156     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(97)00266-9     Document Type: Article

References (11)

1. A.A. Vikarchuk, A.M. Leksovskiy, A. Mamontov, Phys. Met. Metall. 50 (1980) 135.
2. J.P. Celis, H. Kelchtermans, J.R. Roos, Trans. IMF 56 (1978) 41.
3. R. Buchta, W. Schatt, Planseeberichte Pulvermetall. 19 (1971) 268.
4. W. Betteridge, J. Heslop, The Nimonic Alloys and Other Ni-Base High Temperature Alloys. Edward Arnold Ltd., London, 1974, pp. 332.
5. L. Winkler, Galvanoformung - ein modernes Fertigungsverfahren, Teil I. Verfahrenstechnik, Metalloberfläche, 21 (1967) 225-233 and 261-267.
6. R.R. Oberle, M.R. Scanlon, R.C. Cammarata, P.C. Searson, Appl. Phys. Lett. 66 (1995) 19.
7. M.N. Joshi, M. Totlani, J. Electrochem. Soc. India 28 (1979) 35.
8. M. Verelst, J.P. Bonino, A. Rousset, Mater. Sci. Eng. A135 (1991) 51.
9. G.N.K. Ramesh Bapu, Surf. Coat. Technol. 67 (1994) 105.
10. V.O. Nwoko, L.L. Shreir, J. Appl. Electrochem. 3 (1973) 137.
11. A.A. Vikarchuk, Soviet Electrochem. 28 (1992) 974.