Copper extrusion/reinjection in Cu-based thiospinels by electrochemical and chemical routes

Chemistry of Materials

Volumn 18, Issue 18, 2006, Pages 4278-4287

  Bodenez, V ^a   Dupont, L ^a   Morcrette, M ^a   Surcin, C ^a   Murphy, D W ^b   Tarascon, J M ^a  

^a UNIVERSITÉ DE PICARDIE JULES VERNE   (France)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL INSTABILITY; COPPER EXTRUSION; ELECTROCHEMICAL DISPLACEMENT;

BAND STRUCTURE; ELECTROCHEMISTRY; EXTRUSION; LITHIUM COMPOUNDS; OXIDATION; REDOX REACTIONS;

COPPER COMPOUNDS;

EID: 33748863806     PISSN: 08974756     EISSN: None     Source Type: Journal    
DOI: 10.1021/cm060436z     Document Type: Article

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