Enhancing adhesion between diamond film and WC-Co substrate

Jinshu Xuebao/Acta Metallurgica Sinica

Volumn 42, Issue 7, 2006, Pages 763-769

  Li, Jianguo ^a   Hu, Dongping ^a   Mei, Jun ^a   Liu, Shi ^b   Li, Yiyi ^b  

^a RESEARCH CENTER OF LASER FUSION   (China)

^b INSTITUTE OF METAL RESEARCH   (China)

Author keywords

Adhesion; Composite diamond film; H2 plasma; Murakami solution; WC Co

Indexed keywords

ADHESION; COMPOSITE MATERIALS; CRYSTALLINE MATERIALS; CUTTING; INDENTATION; MORPHOLOGY; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS;

COMPOSITE DIAMOND FILM; H2 PLASMA; MURAKAMI SOLUTION; SURFACE MORPHOLOGY; WC-CO SUBSTRATE;

DIAMOND FILMS;

EID: 33748464358     PISSN: 04121961     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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