Anisotropic heat conduction across an interface crack/defect filled with a thin interstitial medium

Engineering Analysis with Boundary Elements

Volumn 30, Issue 5, 2006, Pages 325-337

  Shiah, Y C ^a   Shi, Yi Xiao ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

Author keywords

Anisotropic heat conduction; Boundary element method; Gap conductance coefficient; Interface crack defect

Indexed keywords

ANISOTROPY; BOUNDARY ELEMENT METHOD; COMPUTER SIMULATION; DEFECTS; DIFFERENTIAL EQUATIONS; INTERFACES (MATERIALS); NUMERICAL METHODS; PROBLEM SOLVING;

ANISOTROPIC HEAT CONDUCTION; ANISOTROPIC MATERIALS; GAP CONDUCTANCE COEFFICIENT; INTERFACE CRACK/DEFECT;

HEAT CONDUCTION;

EID: 33748191246     PISSN: 09557997     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.enganabound.2006.01.012     Document Type: Article

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