Simulating and improving microelectronic device reliability by scaling voltage and temperature

Proceedings - International Symposium on Quality Electronic Design, ISQED

Volumn , Issue , 2005, Pages 496-502

  Li, Xiaojun ^a   Walter, Joerg D ^a   Bernstein, Joseph B ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEVICE OPERATIONS; DEVICE RELIABILITY; LONG-LIFE APPLICATIONS; MICRO-ELECTRONIC DEVICES; OPERATING PARAMETERS; SCALING RELATIONS; STRESS CONDITION; SYSTEM DEVELOPERS;

MICROELECTRONICS;

EID: 33748102204     PISSN: 19483287     EISSN: 19483295     Source Type: Conference Proceeding    
DOI: 10.1109/ISQED.2005.110     Document Type: Conference Paper

References (11)

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