Fault Localization and Functional Testing of ICs by Lock-in Thermography

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2002, Pages 29-36

  Breitenstein, O ^a   Rakotoniaina, J P ^a   Altmann, F ^b   Schulz, J ^c   Linse, G ^c  

^a MAX PLANCK INSTITUTE OF MICROSTRUCTURE PHYSICS   (Germany)

^b FRAUNHOFER INSTITUTE FOR MECHANICS OF MATERIALS IWM   (Germany)

^c Melexis GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CAMERAS; ELECTRIC FAULT LOCATION; FAILURE ANALYSIS; FLIP CHIP DEVICES; FLUORESCENCE; INFRARED DEVICES; LIGHT EMISSION; METALLIZING; OPTICAL MICROSCOPY; OPTICAL RESOLVING POWER; THERMOGRAPHY (IMAGING); THERMOGRAPHY (TEMPERATURE MEASUREMENT);

FLUORESCENT MICROTHERMAL IMAGING (FMI); LOCK-IN THERMOGRAPHY;

INTEGRATED CIRCUIT TESTING;

EID: 1542330602     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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