Chip-package codesign of integrated voltage-controlled oscillator in LCP substrate

IEEE Transactions on Advanced Packaging

Volumn 29, Issue 3, 2006, Pages 390-402

  Bavisi, Amit ^a   Dalmia, Sidharth ^b   Swaminathan, Madhavan ^a,b   White, George ^b   Sundaram, Venky ^b  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b Jacket Micro Devices Inc   (United States)

Author keywords

Colpitt's oscillator; Liquid crystalline polymer (LCP); Phase noise; System in package (SiP); System on package (SOP); Voltage controlled oscillator (VCO)

Indexed keywords

CRYSTAL OSCILLATORS; DIELECTRIC MATERIALS; ENERGY DISSIPATION; LIQUID CRYSTAL POLYMERS; OPTIMIZATION; SUBSTRATES; VARIABLE FREQUENCY OSCILLATORS;

COLPITT'S OSCILLATOR; PHASE NOISE; SYSTEM-IN-PACKAGE; SYSTEM-ON-PACKAGE;

CHIP SCALE PACKAGES;

EID: 33747592821     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.853550     Document Type: Article

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