Thermal performance of aluminium-foam CPU heat exchangers

International Journal of Energy Research

Volumn 30, Issue 11, 2006, Pages 851-860

  Mahdi, H ^a   Lopez, Jr ^a   Fuentes, A ^a   Jones, R ^a  

^a UNIVERSITY OF TEXAS PAN AMERICAN   (United States)

Author keywords

Aluminium foam heat sink; Electronics cooling; Thermal resistance

Indexed keywords

COMPUTER PERIPHERAL EQUIPMENT; COOLING; FOAMS; HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; HEATING EQUIPMENT; NATURAL CONVECTION; THERMOCOUPLES;

ALUMINUM-FOAM HEAT SINK; CENTRAL PROCESSING UNIT; ELECTRONICS COOLING;

HEAT EXCHANGERS;

COMPUTER PERIPHERAL EQUIPMENT; COOLING; FOAMS; HEAT EXCHANGERS; HEAT LOSSES; HEAT RESISTANCE; HEAT SINKS; HEATING EQUIPMENT; NATURAL CONVECTION; THERMOCOUPLES;

EID: 33747451679     PISSN: 0363907X     EISSN: 1099114X     Source Type: Journal    
DOI: 10.1002/er.1188     Document Type: Article

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