TOFSIMS analysis of Cu-SiC composites for thermal management applications

Applied Surface Science

Volumn 252, Issue 19, 2006, Pages 7086-7088

  Treichler, R ^a   Weissgaerber, T ^b   Kiendl, T ^a  

^a SIEMENS AG   (Germany)

^b FRAUNHOFER INSTITUTE FOR MANUFACTURING TECHNOLOGY AND ADVANCED MATERIALS IFAM   (Germany)

Author keywords

Cu(Ti) SiC composite; Thermal heat management; TOFSIMS

Indexed keywords

COPPER; ENERGY MANAGEMENT; HEAT CONDUCTION; HEAT LOSSES; HOT ISOSTATIC PRESSING; SECONDARY ION MASS SPECTROMETRY; SEMICONDUCTOR DEVICES;

CU(TI)/SIC COMPOSITE; METAL ALLOYS; THERMAL HEAT MANAGEMENT;

COMPOSITE MATERIALS;

EID: 33747434871     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2006.02.117     Document Type: Article

References (2)

1. Weissgärber T., Schulz-Harder J., Meyer A., Lefranc G., and Kurth R. Proceedings of Materialica. Munich (2000)
2. Nishimoto A., Ando M., Takahashi M., Aritoshi M., and Ikeuchi K. J. Jpn. Inst. Met. 63 (1999) 895-904