Friction bonding of silicon carbide to oxygen free copper with an intermediate layer of reactive metal

Nippon Kinzoku Gakkaishi/Journal of the Japan Institute of Metals

Volumn 63, Issue 7, 1999, Pages 895-904

  Nishimoto, Akio ^a   Ando, Masaaki ^a   Takahashi, Makoto ^a   Aritoshi, Masatoshi ^a   Ikeuchi, Kenji ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM FOIL; BOND STRENGTH (MATERIALS); COPPER; CRYSTAL MICROSTRUCTURE; GRAIN SIZE AND SHAPE; INTERFACES (MATERIALS); NIOBIUM; SILICON CARBIDE; SOLID SOLUTIONS; TITANIUM; TRANSMISSION ELECTRON MICROSCOPY; ZIRCONIUM;

FRICTION BONDING;

CERMETS;

EID: 0032658345     PISSN: 00214876     EISSN: None     Source Type: Journal    
DOI: 10.2320/jinstmet1952.63.7_895     Document Type: Article

References (20)