Effect of sulphuric acid and copper sulphate concentrations on the morphology of silver deposit in the cementation process

Electrochimica Acta

Volumn 51, Issue 27, 2006, Pages 6111-6119

  Sulka, G D ^a   Jaskula M ^a  

^a JAGIELLONIAN UNIVERSITY   (Poland)

Author keywords

Cementation on copper; Dendritic growth; Silver ion cementation; Silver recovery; Surface morphology

Indexed keywords

COPPER COMPOUNDS; ELECTRODES; MORPHOLOGY; SILVER DEPOSITS; SOLUTIONS; SURFACES;

CEMENTATION ON COPPER; DENDRITIC GROWTH; SILVER ION CEMENTATION; SILVER RECOVERY;

INORGANIC ACIDS;

EID: 33747119895     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2005.12.051     Document Type: Article

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