Study on morphology of copper deposited onto aluminium by immersion plating from an oxalate bath containing perchloric acid

Minerals Engineering

Volumn 16, Issue 12, 2003, Pages 1383-1386

  Kanungo, M ^a   Mishra, K G ^a   Das, S C ^a  

^a CSIR INSTITUTE OF MINERALS AND MATERIALS TECHNOLOGY   (India)

Author keywords

Cementation; Electrometallurgy; Reaction kinetics

Indexed keywords

ACIDS; ACTIVATION ENERGY; ALUMINUM; COMPOSITION; COPPER DEPOSITS; CORROSION; CRYSTAL STRUCTURE; MORPHOLOGY; PARTICLE SIZE ANALYSIS; REACTION KINETICS; SCANNING ELECTRON MICROSCOPY; TEMPERATURE;

ARRHENIUS PLOT; IMMERSION PLATING; OXALATE BATH; PERCHLORIC ACID;

ELECTROPLATING;

EID: 0344515460     PISSN: 08926875     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mineng.2003.08.008     Document Type: Article

References (10)

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