Experimental study of workpiece-level variability in blind-via electroplating

Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture

Volumn 215, Issue 4, 2001, Pages 521-530

  Poon, G K K ^a   Chan, J S F ^b   Williams, D J ^c  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b OPEN UNIVERSITY OF HONG KONG   (Hong Kong)

^c LOUGHBOROUGH UNIVERSITY   (United Kingdom)

Author keywords

Acid copper electroplating; Blind vias; Statistical experimentation; Variability control

Indexed keywords

EID: 33747014160     PISSN: 09544054     EISSN: None     Source Type: Journal    
DOI: 10.1243/0954405011518476     Document Type: Article

References (24)

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